Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang
Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re
Electronics Forum | Fri Sep 28 16:51:41 EDT 2001 | pcmarch
I have had success by applying the paste flux with my finger, using a finger cot and spreading it on the PCB. This seems to put it on more consistently than using a brush.
Electronics Forum | Mon Mar 07 20:27:07 EST 2005 | KEN
Oh silver and its...improved solderability over tin / copper. BS if you ask me. Look to your flux and thermal profile for wetting spread. Ask yourself just how much "wetting spread" do you need to fill a barrel? I have the same 100% barrel fill
Electronics Forum | Wed Dec 21 17:11:58 EST 2011 | davef
Kim: We understand what you're saying. For us, fluxing the BGA and activating the flux are the issues. * If you're squirting liquid flux under the BGA with a plastic bottle with a needle tip on it and then reflowing less than the whole board with a
Electronics Forum | Wed Apr 30 07:33:12 EDT 2008 | davef
It's not acceptable to us. More importantly, you need to determine if it's acceptable to your customer. Recognize that your little IPA scrub does NOT remove the OA flux residues from the board. It mearly spreads them out across the board and under c
Electronics Forum | Mon Jun 28 10:03:22 EDT 2004 | davef
First, welcome to your new job. Second, IPC-TM-650 2.6.14 is only loosely an �Ionic Contamination (Electromigration) Test�. * Electromigration Test, IPC TM 650 2.6.14, 2.6.14.1 * Ion Chromatography for Ionic Cleanliness, IPC TM 650 2.3.28 Third, I
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Thu Jul 09 11:13:00 EDT 1998 | justin medernach
| IS IT BETTER FOR SOLDER PASTE TO SPREAD OUT AS FAR AS POSSIBLE ON BARE COPPER, OR FOR IT TO KEEP THE SHAPE OF THE PRINT? I'VE BEEN DOING SOME SOLDER PASTE EVALUATIONS, AND I'M TRYING TO EVALUATE THE RESULTS. I'M NOT SURE THAT BECAUSE A PASTE MAY
Electronics Forum | Thu Aug 30 20:35:51 EDT 2012 | davef
A common bottomside heater configuration is IR-Convection-Convection. One of the big advantages of the IR zone is its ability to allow the flux carrier to spread and dry slowly before the board reaches the convections zones, which can blow wet flux c
Electronics Forum | Thu Oct 15 13:55:43 EDT 1998 | Steve A
Dave, The first step would be to learn to accept the residue. IPC class 2 has no problem with it. If that is not possible, I am not sure why a no clean is necessary- but I will take your work for it. Alcohols will dry out the residue, and turn it
