Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman
We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als
Electronics Forum | Wed Aug 10 16:37:35 EDT 2011 | davef
Yes, there are ways to machine process boards like this. The devil is in the detail. In no particular order, your choices are: Process flow #1: * Print chipbonder on the surface mount side for SMT parts * Mount SMT components * Cure adhesive, if r
Electronics Forum | Tue Dec 04 10:30:16 EST 2007 | slthomas
Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong
