New Equipment | Cleaning Equipment
Field of application: Suitable for steel mesh,copper mesh,porous network and crystal and other types of discscreen cleaning; also suitable for circuit board,fixture,scraper and othersimilar products and cleaning appliances Features: 1.Stainless
Product technical points ● Humanized design ● Wide application range and strong versatility ● Unique spray automatic cleaning system ● High-efficiency and energy-saving wiping and paper-saving structure ● Unique image processing system ● Intelligent
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed Apr 18 00:00:00 EDT 2018 - Thu Apr 19 00:00:00 EDT 2018 | ,
Stencil Printing Process and Solder Paste Inspection – An In-Depth Look - SMTA Webtorial
New Equipment | Cleaning Equipment
Batch - Inline - Stencil Cleaners - Speedline Electrovert, Trek, Stoelting, Unit Design, Aqueous Technologies, EMC, Smart Sonic Batch-Inline-Stencil Cleaners for sale at JMW Enterprises
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Technical Library | 2010-03-23 11:50:22.0
This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
