Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Tue Nov 27 07:51:21 EST 2007 | shy
is there any gap between the pad and terminal if we place the glue? Btw, my practice to print solder pate then punch glue then PNP component and finally reflow. Also we find drop/missing chip after wave eventhough we glue the component.
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Tue Nov 27 08:21:43 EST 2007 | shy
How many mils the gap between the terminal and pad? Your practice is for technology SMT-4? What is problem with glue cure? is it due to the reflow profile? how long the glue can be keep in room temperature with humidity 40-60?
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
Electronics Forum | Wed Nov 28 01:07:36 EST 2007 | shy
is there any standard gap between the terminal and pad if we place the glue? SMT-4 mention as per what you understand which is using glue at SMT without solder paste and run at wave solder for the solder paste at the terminal. Glue supplier recomm
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Mon Dec 03 20:30:58 EST 2007 | shy
Q: I thought you said that the parts that weren't wetting in reflow were the parts with epoxy. A: Yes you're correct. Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in ref
