Industry News: bga voids (Page 2 of 13)

PNC Inc.’s BGA Assembly

Industry News | 2017-03-23 11:33:40.0

Outline of PNC Inc's BGA assembly capabilities.

PNC Inc.

MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference in Shenzhen

Industry News | 2020-08-22 04:19:37.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.

MacDermid Alpha Electronics Solutions

New, Large Capacity, Ultra-High Resolution X-Ray Inspection System.

Industry News | 2002-07-25 15:33:58.0

Glenbrook Technologies has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system, "Oversized" Jewel box 90-C. The system facilitates x-ray inspection of larger assembled printed circuit boards (PCBs) up to 18" x 24".

Glenbrook Technologies

Glenbrook Technologies introduces two new models of popular Jewel Box X-ray Inspection Systems

Industry News | 2016-03-02 12:50:36.0

The Jewel Box Ultra Compact is a full featured microfocus x-ray system that can easily fit on a desk or in a small lab. It offers up to 500x geometric and 2,000x electronic magnification. The Jewel Box Oversize is designed for backplane and LED panels. The system can accommodate a 24" x 24" panel and the positioner can fully scan 23" x 12".

Glenbrook Technologies

Kester to Showcase NXG1 No-Clean Paste at SMTA Atlanta Expo & Tech Forum

Industry News | 2010-03-24 14:00:36.0

ITASCA, IL - Kester announces that representative Gardner & Meredith will showcase its NXG1-HF, a lead-free no-clean solder paste, at the upcoming SMTA Atlanta Expo and Tech Forum, scheduled to take place Thursday, April 15, 2010 at the Gwinnett Civic Center in Duluth, GA.

Kester

Improve board level reliability by reducing solder joint voiding below 10%

Industry News | 2023-11-20 13:47:24.0

MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.

MacDermid Alpha Electronics Solutions

Indium Corporation Soldering Technology Expert to Present at IMPACT 2014

Industry News | 2014-09-23 11:18:59.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys.

Indium Corporation

Glenbrook's New Jewel Box X-Ray Systems

Industry News | 2001-11-13 13:41:24.0

Glenbrook Technologies Inc., an innovator and leading supplier of Real-time X-ray Inspection Systems to the electronic fabrication and semiconductor assembly industries has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system called the "Oversized Jewel Box 70-T". Glenbrook's award-winning X-ray camera technology combines a 10 Micron, 70kV X-ray source with extremely small "Source to Image Distance" (SID) to capture ultra-high resolution images.

Glenbrook Technologies

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

VJ Electronix, Inc. Receives the NPI Award for Its New Vertex II X-ray System

Industry News | 2013-02-21 06:57:08.0

VJ Electronix, Inc.,announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – AXI for its Vertex II next-generation X-ray technology.

VJ Electronix


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