Electronics Forum | Wed Feb 09 06:35:18 EST 2000 | Mark Williams
Hi We use 2 criteria... maximum void size is 10% of the solderable surface and a maximum area of voids of 10% of the maximum cross-sectional area of the ball. Any views Mark
Electronics Forum | Tue May 02 07:56:58 EDT 2006 | billyd
Yeah, that's what I'm doing now. I have it now peaking around 235, with about 70 sec. above 220C. (220C is the reflow temp, according to manufacturer. I've always used 217C for Pb free) Wish me luck. Thanks!
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Tue May 02 07:46:39 EDT 2006 | Bob R.
Be careful about taking any generic advice and trying to use it to reduce voiding for your particular paste with your particular boards. I've done a few literature searches over the years on causes/cures for BGA voiding in the SnPb world and found a
Electronics Forum | Tue Jan 18 12:44:24 EST 2000 | Russ
I have found that reducing the amount of metal in the joint makes a difference, we have reduced the aperture sizes to provide a minimal amount of paste. just enough to hold the part during handling. You may also want to try and slow the initial ram
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Mon Jan 17 21:01:21 EST 2000 | Dave F
Dennis: On your BGAs: * Never seen voids any place other than the top ... lower density stuff rises. * Our spec on voids says: 1 Voids 1a Voids in soldered balls shall be less than 20% of the diameter of the solder ball. 1b No void shall sho
Electronics Forum | Tue May 02 07:19:29 EDT 2006 | billyd
Good morning all. I'm trying to find some help on my voiding issue on my lead free BGAs. I am using a Heller 8/2 zone oven, and using Qualitek solder paste. I had listened to a tech representing another solder company, who told me to make the joints
Electronics Forum | Tue Mar 06 14:10:52 EST 2001 | CAL
Are the voids in the balls of a BGA? Are you verifying this through x-ray if they are? some voids depending on size and location are some what accepted. Solder paste type? Solder paste date code? Humidity high? PCB's been stored in a truck trailer?
Electronics Forum | Fri Jan 16 07:00:32 EST 2004 | mk
ssd eliminates voids from BGA's. Check out http://www.sipad.com
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