Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She
Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan
Electronics Forum | Thu Mar 10 07:11:56 EST 2005 | py (france)
Hi, see below.. http://www.omnigraph.com/index1.html?content=/subpages/review.html
Electronics Forum | Fri Jul 24 01:28:00 EDT 1998 | Alex Ondi
I also heard of a company considering a patent on aperture design. The aperture was a "chevron" aperture, very similar to the "V" shaped aperture recently touted in SMT magazine, presumably for the purpose of reducing solder balls. Go figure!
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Wed Feb 18 14:45:33 EST 2004 | Mauro Pinheiro
I'm looking for a shareware software that I could use for specifying stencils (we are stencil users not manufacturers). I would like to enter some preliminary spec in a software form, such as: the smallest pad geometry on pcb (possibly selected from
Electronics Forum | Wed Apr 27 20:55:10 EDT 2005 | KEN
One thing that may have been over looked: Not all solder pastes are created equal. Period. The best way to avoid these situations is to characterize you material (and your process). The fact is you could try every aperture shape under the sun....a
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Mon Jul 20 19:31:00 EDT 1998 | Eric
| | :On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their ow
.gif)
