Electronics Forum: aluminum wire (Page 2 of 5)

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero

I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has

temperature induced IMC in wire bonds?

Electronics Forum | Tue Nov 15 21:06:04 EST 2005 | davef

Is your IMC purple? [The sure way to tell if you have the 'purple plague'.] Where does the failure occur? * At pad / wire bond * Up wire from the bond Tell us about the aluminum pad. * What is the plating specification? Is that what you actually r

ks bonding problems gold wire on al pads

Electronics Forum | Tue Nov 07 22:44:39 EST 2017 | wrander1

Hi I'm new to the world of wire bonding. I seem to have some sort of pad contamination Preventing gold wire from bonding to aluminum pats. There appears to be a dozen microns size particles. And a slight crackling of the surface at 500 X. I am send

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef

5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke

PCB finish requirement for COB process

Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef

Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt

Wire Bonding

Electronics Forum | Sun Jan 22 09:44:17 EST 2006 | davef

Wire bonding is a die connect methodology that runs either gold or aluminum wires between pads on the integrated circuit to either a lead frame or pads on a printed circuit board. For more look here on Daan Terstegge's excellent link page http://www

transformer winding machine

Electronics Forum | Tue Sep 26 07:46:49 EDT 2023 | robertanderson

A transformer winding machine is a specialized piece of equipment used in the manufacturing of transformers. Transformers are electrical devices that transfer electrical energy between two or more circuits through electromagnetic induction. They cons

COB and Plating

Electronics Forum | Tue Oct 07 12:35:10 EDT 2008 | andy_pal

Hi All, I am using COB on my DOUBLE SIDED PCB. lastly we used Eletrolytic Ni / Flash Gold Plating. Our Boards vias Failed the UL corrosion Test. we did some cross-section analysis and found 10.75 �m of Nickel and 0.022 um of Gold and as the Process

COB Process (Chip On Board)

Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI

Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject


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