Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.
Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor
Electronics Forum | Fri Aug 08 07:52:26 EDT 2003 | pteerink
We have seen this for quite a while too ( chip components and IC's with lead free plating on the terminations ) and we did just what Dave said, crank up the heat. Also switched to newer formulations of solder paste, that are "more active" and have gi
Electronics Forum | Fri Aug 08 12:46:02 EDT 2003 | davef
When I was a salty old fart in the Navy, we sent the babes from the turnip patch off on snipe hunts. Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied
Electronics Forum | Wed Jan 07 09:09:44 EST 2004 | russ
Her is how we rework these typew of components. First remove the device using hot air. It is sometimes helpful to heat the back of the board if possible to get the thermal pad heated with less strain on adjacent comps. Remove the remaining solder
Electronics Forum | Fri Mar 19 07:24:29 EST 2004 | pjc
Before "Pb-Free" became an issue we were and still are using Pb-Free component lead finishes- such as on many TSOP, SSOP and QFP packages as well as caps. Components manufacturers changing the lead finish to no-Pb tend to ensure solderability with Sn
Electronics Forum | Mon Apr 12 09:09:25 EDT 2004 | russ
If they are reflowing pbfree balls to bare PCB pads they are getting that component very hot tpo melt the balls and get them to wet to the pads! I would not recommend this process at all for hightemp solder balls, for 63/37 this process is fine. As
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef
There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She
Electronics Forum | Wed Jun 23 13:37:12 EDT 2004 | bbarr
We have had an RTX-113 since 1997. I echo Cal's comments with respect to experiences with the unit and the desire for the angle viewing. Don't know if the angle viewing is available on the RTX-113. You should look at a unit with that option before ma
Electronics Forum | Sat Jul 03 00:58:57 EDT 2004 | KEN
so what did we do before X-ray? sound process shouldn't need to rely on inspection. Extended soaks can be used to burn off high temp volatiles but I have never heard of 5 minutes! I have used 90-120 sec. to reduce solder splatter....but haven't do
