Electronics Forum | Tue Jun 23 12:39:58 EDT 1998 | Brian Conner
I am experiencing a wave-soldering problem with a leaded capacitor - too much solder above the board!! The capacitor lead is .020" dia. and the hole size is .038". This only occurs on the negative lead of the component. The capacitor is also axial
Electronics Forum | Tue Jun 23 18:43:23 EDT 1998 | D.Lange
| I am experiencing a wave-soldering problem with a leaded capacitor - too much solder above the board!! The capacitor lead is .020" dia. and the hole size is .038". This only occurs on the negative lead of the component. The capacitor is also axi
Electronics Forum | Tue Jun 23 12:38:55 EDT 1998 | Brian Conner
I am experiencing a wave-soldering problem with a leaded capacitor - too much solder above the board!! The capacitor lead is .020" dia. and the hole size is .038". This only occurs on the negative lead of the component. The capacitor is also axial
Electronics Forum | Fri Apr 17 14:03:48 EDT 1998 | Earl Moon
| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | Wed Oct 31 18:00:51 EST 2001 | Jonathan Mitchell
Hi All! In the near future we will begin to take on products that require a reflow process on both sides. We will run the backside first (smaller components) to reduce the chances of a part falling off during the second reflow, but my question is abo
Electronics Forum | Thu Nov 01 05:30:06 EST 2001 | wbu
This is not about the physical laws but besides contamination, which will actually IMO cause NO WETTING, it is quite vital that the time-limit the flux is active is not exceeded during your reflow process. Depending on your paste/flux you will have a
Electronics Forum | Sun Dec 09 22:54:20 EST 2001 | dburr
It sound you have already discovered to root cause, flux entrapment in the via holes. Short of changing the desing, here are sone suggestions. The main thing is you have to dry out the via holes of the wet flux. Some things to try are: slow down t
Electronics Forum | Mon Dec 10 16:44:51 EST 2001 | davef
Good for you!!! Similar to Steve's comments ... 1. NON-WETTING DEFECT: Yes. Your Lonco is a �stand and deliver� flux. Not some limp wrested impersonation of a flux like most nc fluxes. Without speculating about �incompatability�, recognize that
