Electronics Forum: selective soldering (Page 125 of 152)

Reducing Wave solder DeltaT

Electronics Forum | Wed Jan 27 11:58:35 EST 2010 | randyw

Our products are a mixed technology; with both surface mount components solder side and through-hole top side, in addition to massive heat sink assemblies. We have been using your SN100C solder in our wave solder process with Multicore MFR301 Flux si

Re: Process Change

Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

AOI selection,specifically ViTechnology and Mirtec

Electronics Forum | Wed Oct 26 14:20:41 EDT 2005 | TPM

Brian, We have the Mirtec Table Top. It is very good at detecting the component and orientation. It is however only as good as we program it to be. We have seen some limitations in respect to solder connections. I have not found it to be 100% re

Selective moving pot vs fixed pot

Electronics Forum | Tue Jul 08 12:21:42 EDT 2008 | jwasyliw

Biggest differnce is tooling. Tooling cost with > a fixed pot - no tooling cost with programable > "moving"pot. > > There are various way to control > peel off with a moving pot. Depending on the > machine, you can use either the Z axis or the

defect on PCB acrylic conformal coating

Electronics Forum | Thu May 09 13:49:24 EDT 2013 | davef

First, it appears that your solder mask and your coating material appear to be incompatible. Second, IPA leaves a residue that's probably not compatible with your coating material, either. IPC-HDBK-830 - Guidelines for Design, Selection and Applic

Re: Process Change

Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change

Electronics Forum | Thu Jun 03 13:00:16 EDT 1999 | Earl Moon

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Fri Jan 14 07:55:07 EST 2000 | Pat Pepper

Hi Wolfgang, Thanks for the response. We had a similar situation to yours with some white tin samples that sat around for about eight months. Samples soldered right after they arrived soldered better than the ones we soldered eight months down the

Questions About Risk of PCB Delamination as a Result of Moisture Build Up After Damage to Solder Mask

Electronics Forum | Tue Apr 23 15:36:27 EDT 2019 | davef

Josh, are you setting someone up with these questions? Answers to your questions related to the subject line follow: Q1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask?

MPM 2000

Electronics Forum | Tue Nov 08 10:52:29 EST 2016 | aemery

Tom, Hardware limit means the machine thinks it is at the limit sensor or a particular axis timed out before it got to the home sensor during the reset sequence. Go to your O/I map and see if any of the axis limit sensors are lit. You could have a


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