Electronics Forum | Mon Dec 07 09:22:50 EST 1998 | rick
| Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | Any in
Electronics Forum | Fri Nov 27 04:56:36 EST 1998 | Terry Keen
Hi I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the diff
Electronics Forum | Sat Sep 05 18:51:34 EDT 1998 | Graham Naisbitt
John, I believe that your problem is cuased by inadequate filling of the transformers with potting material - if any is used at all. When you attempt to clean, particularly with a chemistry, it is designed with wetting agent, surface tension modifier
Electronics Forum | Fri Jul 10 14:20:24 EDT 1998 | Bob Willis
Yes bright shiny joints are a myth as many people like dull joints as they are easier to inspect due to reduced reflection of light. The difference you are seeing in the joints is more likly to be a surface effect, flux or just you think its differen
Electronics Forum | Wed Jul 01 10:49:01 EDT 1998 | Richard Jackson
I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built some go
Electronics Forum | Thu Jun 25 20:26:37 EDT 1998 | Chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Tue Jun 30 11:51:41 EDT 1998 | Michael Fogel
| | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everyt
Electronics Forum | Thu Jul 02 19:18:31 EDT 1998 | Rin
| | | | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. E
Electronics Forum | Thu Jun 25 20:16:01 EDT 1998 | chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Thu Jun 25 11:47:39 EDT 1998 | Steve A
| Hi there, | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | Appreciated for your help. | rgs, | chiakl Chiakl, It looks like you are speaking of what could
