Electronics Forum | Fri Oct 13 05:21:08 EDT 2000 | Robert Steltman
Looking at the original post, it seems that the white residue is formed on the board after wave soldering and becomes evident when it has been left standing for a while. From what I understand, it seems that the solids content of the "no clean" flux
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Fri Oct 02 01:21:08 EDT 1998 | Mike Cox
Kyung Sam, | | Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Mon Jan 10 19:13:46 EST 2000 | TNT
HELLO MIKE, THE PROBLEM WITH THE VIA BEING IN THE MIDDLE OF THE PAD CAN BE HANDLED. IF YOU ARE HAVING PROBLEMS WITH SOLDER FLOWING THROUGH AT REFLOW YOU MIGHT WANT TO CHECK YOUR VACUUM AT YOU SCREEN PRINTER. SOMETIMES THE VACUUM THAT HOLDS THE PCB
Electronics Forum | Fri Jan 21 16:50:33 EST 2005 | Board House
I work for a board house and our proceedure for this process is the following, We cover the via pads leaving the hole open and then apply the surface finish and then go back and Cover the Via with a second operation. By doing this you do not entrap
Electronics Forum | Fri Oct 24 06:55:48 EDT 2008 | clampron
Good Morning WS, If you experieced the solder balls after reflow of a bare board through the oven, then the source of the solder is either the oven or the board. I have had boards with untented via's that were HASL'd that had entrapped solder and fl
Electronics Forum | Mon Nov 13 13:27:51 EST 2006 | Javier
It really depends on what deliverables BTU can offer and successfully accomplish without the complexity of various reinvention activities. The basis of its� vehicle stability as a total platform should be broken into a framework of goals and objecti
