Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef
Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con
Electronics Forum | Fri Mar 24 08:32:17 EST 2006 | davef
Lifted pads are almost always caused by pad to substrate adhesion likely degraded significantly after too much heat. Poorly trained operators armed with soldering irons can do this expertly.
Electronics Forum | Thu May 25 09:14:04 EDT 2006 | cobar
Print a number of pads of the 0603 on to a ceramic substrate. Then place the 0603 on the paste on the ceramic and refow. If the paste shows no wetting onto the component it will prove that there is a problem with the components solderability.
Electronics Forum | Thu Aug 17 23:44:26 EDT 2006 | guest
CBGA stands for Ceramic Ball grid array while PBGA stands for Ceramic Ball grid array. Noticable difference is the substrate used , one is using ceramic and one is using BT laminate. Regards
Electronics Forum | Wed Aug 01 12:23:21 EDT 2007 | stepheniii
Don't forget rework, post production eco's and other mods. Also if it's on a generic base, how do you spot slight misplacments? Board shops have some fallout, now the fallout with be with the assembly makers and with components trapped on the subst
Electronics Forum | Tue Sep 04 13:33:55 EDT 2007 | floydf
We "bar" solder them too. (It's really pulsed resistance welding). It's slow but reliable. They seem to be designed for this process. By the way, Luxeon just came out with new LEDs that have nearly the same luminous flux, but that can withstand leadf
Electronics Forum | Mon Sep 10 23:13:08 EDT 2007 | weehn
hi, i'm from the semicon (BGA assembly). Could you advice what is the best method / procedure to remove OSP coatings from pads of the BGA substrates. thanks Wee
Electronics Forum | Mon Nov 05 19:43:09 EST 2007 | davef
"Effects of surface finish on high frequency signal loss using various substrate materials" - Call Don Cullen at Mac Dermid or Larry Gatewood at Rockwell Collins for a copy.
Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir
Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?
Electronics Forum | Thu Jun 19 13:29:18 EDT 2008 | gregp
Hi Steven, Those types of substrates generally require special conveyoring for the reasons you stated. The best material would be hardened steel although you might be able to use hardcoated aluminum. The process is similar to anodizing but the fini
