Electronics Forum: moisture (Page 13 of 135)

Excessive Heat / Thermal Excursions From Baking

Electronics Forum | Fri Sep 03 17:39:06 EDT 2021 | stephendo

The most common issue with baking parts for removing moisture too much, is oxidation of the leads. But I haven't seen that too much. I'm really curious what moisture magnets are and how they work.

voids in solder

Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp

Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are

Moisture sensitive Devices

Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan

I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

Moisture Sensitive Devices - Absorption Labels

Electronics Forum | Mon Jan 12 14:07:53 EST 1998 | Yves Trudell

I've heard of a series of labels that absorb moisture at different rates and/or change appearance when a specific saturation level is reached. If such labels exist and if they could be correlated to the exposure limits of specific moisture sensitivit

double side reflow soldering

Electronics Forum | Wed May 15 12:55:11 EDT 2002 | fmonette

Hi Dave, The short answer is "not any significant amount" of moisture is removed during reflow. The temperature excursion is much too short. If you look at the physics of moisture diffusion inside a package you will see that only the surface moist

Questions About Risk of PCB Delamination as a Result of Moisture Build Up After Damage to Solder Mask

Electronics Forum | Tue Apr 23 15:36:27 EDT 2019 | davef

Josh, are you setting someone up with these questions? Answers to your questions related to the subject line follow: Q1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask?

Handling of Moisture sensitive devices

Electronics Forum | Fri Jan 21 18:47:14 EST 2000 | Ashok Dhawan

This massage is for clarifications on storage and handling of Moisture sensitive parts: Does chip resistors,capacitors and inductors need vacuum packing during usage life? For repacking of FPDs to limit reuse, is it necessary to use vacuum seler or s

Re: Shelf Life of Components

Electronics Forum | Fri Dec 03 18:01:39 EST 1999 | Dave F

Chris, Two points of perspective are: 1 Solderability: The shelf life of components has elapsed when they are no longer solderable. There's tons of variables that affect this, but keys are: * Intermetalics grow as a function of temperature. * Th

Re: Popcorning BGA in wave-soldering

Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech

We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the


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