Electronics Forum | Fri Jun 18 15:39:47 EDT 1999 | Earl Moon
| What's wrong with the Tin? Just wondering | | MDCox | | | | Electroless silver had promise, from Alpha, but I don't know where this ended up. Also Omikron's "white" electroless tin is proported to be a good alternative, though I've never been a
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Thu Apr 27 11:36:53 EDT 2000 | PeterB
Russ, We also use 'immersion silver' and have not had any impact on our processes. In fact there are a number of benefits i.e very flat pads (as good as electroless nickel/immersion gold but much cheaper and less unfriendly to the environment), good
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Tue Feb 01 06:54:19 EST 2000 | Roni H.
Hi, Does anyone have experience with gold over nickel (electroless) PCB finish: - Repeatble quality from PCB mfg. (very "painfull" with ENTEK). - Environment condition sensitivity. - Thermal processes sensitivity. - Solderability (Reflow & wave). -
Electronics Forum | Mon Oct 25 15:56:56 EDT 1999 | Dave F
William: Three things: 1 If the gold is porous, it will not protect the nickel and the nichel wiil oxidize and become unsolderable. 2 If the nickel is not solderable, the gold overcoat will not improve that. 3 Ag or Au over electroless Ni creates b
Electronics Forum | Mon Oct 25 16:35:04 EDT 1999 | William
I am pretty sure I am not having a problem w/porous gold or nickel that does not solder. How about electroless versus electrolytic? I thought electrolytic was for goldfingers and such applications. Can you use electrolytic plating for fine pitch a
Electronics Forum | Mon Oct 25 21:28:38 EDT 1999 | Dave F
3%) concentrations of gold form brittle intermetallic compounds with the tin in your solder. Electroless gold is applied with an autocatalytic process that self-limits around 5 mils thickness. You're correct electrolytic gold is used for goldfinger
Electronics Forum | Sat Jan 30 21:04:32 EST 1999 | Sidharth
Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? partic
Electronics Forum | Tue Aug 18 10:05:11 EDT 1998 | Ben Salisbury
Question: If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? I'm currently running into this proble
