Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon
| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |
Electronics Forum | Tue Aug 31 20:51:20 EDT 1999 | Raeto Zryd
Dear fellow process engineers, Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints were
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Wed Aug 18 12:35:41 EDT 1999 | Earl Moon
| | WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE
Electronics Forum | Wed Aug 18 21:18:00 EDT 1999 | Dave F
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Thu Jul 15 11:57:15 EDT 1999 | nards penalosa
We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwell
Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon
| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe
Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa
| | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d
Electronics Forum | Wed Jun 23 06:26:07 EDT 1999 | Graham Naisbitt
| You may want to rethink using an inline for both OA and No-Clean applications. Since the majority of your applications are OA, it would not make a lot of economic sense to run saponifier in your inline for a minority application. My suggestion is
