Electronics Forum | Thu Sep 30 12:02:20 EDT 1999 | Wolfgang Busko
| I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | What is the best way to achi
Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon
| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |
Electronics Forum | Tue Aug 31 20:51:20 EDT 1999 | Raeto Zryd
Dear fellow process engineers, Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints were
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian
| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar
Electronics Forum | Wed Aug 18 12:35:41 EDT 1999 | Earl Moon
| | WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE
Electronics Forum | Wed Aug 18 21:18:00 EDT 1999 | Dave F
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Thu Jul 15 11:57:15 EDT 1999 | nards penalosa
We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwell
Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon
| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe
