Electronics Forum | Thu Feb 22 05:33:51 EST 2001 | mattias
Hello all I just wanted to spread the word regarding the use of sugar to remove burnt-in flux. Dissolve sugar into warm water and spray it on the area that You want to clean,let it work for a short while and rub. If you want to do it the manual wa
Electronics Forum | Tue Mar 13 14:17:00 EST 2001 | blair
Thanks a lot for the response 1) there are 8 BGA on this board 6 PBGA, 1 TBGA and 1 ESBGA (metal lid). They are dispersed over the board (approx 11"* 14") 2) Is there a tool to use to understand pitch/bump size and stencil aperture (optimized)? 3) Y
Electronics Forum | Tue May 01 19:27:37 EDT 2001 | djarvis
I have to say I agree with Dave. The experience in Oz is that OEM's that dabble with EMS tend to go broke. The ones that do survive tend to have big brothers with deep pockets to get them over their lean periods but even they will only put up with so
Electronics Forum | Tue Aug 22 10:53:45 EDT 2000 | Dr. Ning-Cheng Lee
Excellent question. Alloy development is relatively easy compared to flux formulation. New fluxes for Pb-Free alloys need upgrades in 2 critical areas: 1) thermal stability 2) oxygen barrier efficiency Since the Pb-Free alloys require reflow proce
Electronics Forum | Mon May 14 14:51:36 EDT 2001 | Brian W.
Personally, I prefer the OSP. I get a flat surface to deposit paste on, resulting in more consistent solder paste volumes. With HASL, the amount of plating and the mounding affect the paste deposition. I have even had it affect the placement. The
Electronics Forum | Wed Jun 13 21:25:48 EDT 2001 | dougk
We've tried the MPM rheo., with excellent results. We saw a decrease in fine-pitch pad coverage rejects from ~20% to bacicially ~0%. Print speeds went from 1-2 in/sec (metal blade) to 4-5 in/sec (rheo.). Could probably go faster. Great throughput. Li
Electronics Forum | Fri Jul 20 18:07:16 EDT 2001 | mparker
The latent contamination in sponges seems to be a minimal concern to me. Sponges will harbor more bacteria than a wet rag that is washable, but that is of greater concern in the kitchen than the rework line. Keeping a properly tinned solder tip is m
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
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