Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Tue Jan 16 21:27:56 EST 2001 | davef
No we do not use such a storage unit. We say our preferred environment is within: * 30%RH / 84�F * 30%RH / 72�F * 70%RH / 78�F * 70%RH / 68�F J-001C says [words to the effect of]: * At 30%RH and below you�d better make sure your ESD control program
Electronics Forum | Mon Mar 30 07:44:12 EST 1998 | Earl Moon
| | | | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | | We have already reduced the pad width from .050" to .040" based on input | | | | from vendor. Defects appear to be random as far as location on the PWB and d
Electronics Forum | Fri Sep 22 16:21:31 EDT 2006 | patrickbruneel
Figure 1. Human Toxicity Potential, Life-cycle Comparison Tin/lead solder paste is the top formula. SAC is second from the bottom.3 RoHS Report Excludes Comparisons By George A. Riley, contributing editor A European Union (EU) Commission for Envir
Electronics Forum | Mon Aug 10 11:28:19 EDT 1998 | Justin Medernach
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
Electronics Forum | Tue Dec 17 09:48:44 EST 2002 | russ
Temps are related to the components/PCBs being soldered. I am not aware of any Industry standard. If you are soldering flex circuits, .020" boards etc.. We use 500 deg tips a little thicker PCB/lead we go to 600, and so on. We never exceed 800 in a
Electronics Forum | Fri Jan 20 09:17:59 EST 2006 | George
Hi "theSaint", We are using SN100C in our wave solder machine. As far as the solder itself, the wave process follows pretty much the same concept as leaded solder. You bring the assembly temp to 90 C or more before the actual wave. Sometimes for mul
Electronics Forum | Wed Mar 27 16:54:47 EST 2002 | davef
STARTING RANGES * Pressure � 1 pound/inch of blade (metal); 1.6-3 pound/inch (plastic) * Speed - 0.5 to 3 inch per sec [for standard pitch]; 0.5 to 1 inch per sec [for fine pitch] Your paste supplier�s recommendation is a good place to start. * Sepa
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