Electronics Forum | Mon Jun 12 10:57:51 EDT 2000 | Jason
I am new to wave soldering. Any information is greatly welcomed. Here is the problem. After soldering the boards they have a film on the bottom of them and sometimes a white powder looking substance. I have tried decreasing the amount of flux on
Electronics Forum | Fri Jun 02 09:31:26 EDT 2000 | C.K.
Okay, there's a debate here at my company. We build a card here that, often times, we get batches where there is excess HASL in the VIA hole barrels. Here is the problem that this causes: During the "1st reflow", the excess HASL bleeds out of the
Electronics Forum | Tue May 30 21:14:31 EDT 2000 | Dave F
Sal: JAX makes good points, but I�d like to think about this differently. It sounds like the poorly soldered connection is lifting the whole connector, so that termination floats on top of the solder, rather than submit to the wetting force and be
Electronics Forum | Fri May 05 14:30:11 EDT 2000 | C.K.
I'd have to disagree with the Electrovert applications guy. I'd recommend SLOWING down the conveyor between .5 to 1 FPM - effectively, you're REDUCING contact length (because contact length = dwell time * conveyor speed), hence getting better peel-o
Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith
I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Fri Mar 17 07:51:49 EST 2000 | Peter Barton
John, I have had previous experience of immersion silver coated PCB's in place of HASL coated type using no-clean processing with little or no problem at all. All of the process parameters were left unchanged. There is a very minor difference in th
Electronics Forum | Thu Feb 17 11:38:53 EST 2000 | Steve Thomas
We appear to have solved a major reflow process problem (poor quality joints on a 20 mil QFP100...excessive solder left on the lead leg, not much left for a joint) with a design change to the board. We gave ourselves considerably more room for a hee
Electronics Forum | Tue Feb 20 16:33:08 EST 2001 | davef
Time, time, time. There just never seems to be enough!!! Eh? You�re correct. Depending on the material, some trays can take a high temperature bake, while other trays, in addition to tubes, and reels, require a low temperature bake. With this la
Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL
SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed
