Electronics Forum | Wed May 28 08:46:39 EDT 2008 | ck_the_flip
I've talked to several Applications Engineers and Chemists from a couple of different paste manufacturers and they confirm that the profiles on their data sheets are nothing but guidelines. It's up to you, Process Engineer or Process Tech, to develo
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Tue Aug 09 10:02:07 EDT 2005 | davef
Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down) should be greater than 330*C for lead-free. Search the fine SMTnet Archives for more on Td.
Electronics Forum | Tue Aug 15 19:07:13 EDT 2006 | vlad_uk
With the added temperature peak associated to Lead free reflow is anyone seeing or concerned about the increased vapor pressure that may result from moisture entrapment in moisture sensitive components?
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Wed Jan 30 17:48:31 EST 2002 | davef
Expanding on a previous poster's comments ... Vapor Phase Soldering. A solder reflow technology that uses a heated solvent to melt the solder. Buried deep in the recesses of the SMTnet Library is �Terms & Definitions�. We started using vapor phas
Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail
This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -
Electronics Forum | Thu May 18 08:12:22 EDT 2006 | marc
smt You should have no issue using your exsisting oven for both leaded and lead free materials if the machine is capable of delivering the desired profiles. One aspect that makes a "lead free" oven is the design of the system. Ability to reach th
Electronics Forum | Tue Jun 28 13:23:56 EDT 2005 | Bob Gilbert
Matt, Try a cooler profile by simply speeding up the conveyor by 10%. The difference may be the temperature the pads are reaching between the HASL boards and the Au boards. Are they the same thickness?
