Electronics Forum | Thu Jul 01 11:48:10 EDT 2010 | mb_mfg
Sid, Try baking the boards before running, to insure no moisture. Baking out the moisture will help prevent warping. Should you need further assistance, we supply fixtures to force the board to stay flat to reduce to thermo shock during wave solde
Electronics Forum | Fri Jan 21 13:27:38 EST 2011 | mosborne1
Try baking your boards first to remove the moisture. Moisture and boards that have not been drilled properly will cause pin hole or blow holes in PTH. Also take a look the surface of the pads before printing. You maybe contaminating the surfaces of t
Electronics Forum | Mon May 21 11:14:06 EDT 2012 | joeherz
Polymide is like a sponge and absorbs moisture much faster than rigid substrates. Pre-bake your substrate for 2-4 hours at 125C and perform your soldering within 1 shift thereafter or seal in moisture barrier bags.
Electronics Forum | Fri Jun 01 04:05:25 EDT 2012 | grahamcooper22
If you think the root cause is excess moisture in the pcb then try to bake it for longer. Even longer then the manufacturers recommendation. It takes a long time for excess moisture to come out of a pcb. Try 24 hours , then 36 hours and see if there
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
Electronics Forum | Wed Jul 13 05:17:56 EDT 2016 | salini
How the moisture is not effecting the moisture sensitive devices after board assembly solder process when kept inside a cabinet with IP 20 rated?
Electronics Forum | Wed Jul 13 11:59:06 EDT 2016 | emeto
Moisture before reflow is consideration, because damages parts and boards in the reflow process. It is all about this water expanding as gas and cracks part or causes PCB delamination. Moisture after reflow is still affecting the work of the product
Electronics Forum | Thu Jul 14 02:25:59 EDT 2016 | salini
Thanks Evtimav and davef... We are doing tar potting only over the moisture sensitive device (not all over the PCB) to make sure that it does not get effected by moisture. But am unable to test the reliability of the process. Continuous switching or
Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci
I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.
Electronics Forum | Tue Jul 13 12:36:44 EDT 2021 | djenkins62
Thank you for suggested test. Very solid. I will run it by the engineering dept at San Jose State. thank you.
