Electronics Forum | Mon Aug 23 11:27:00 EDT 1999 | Dave F
0.6 �m (25 micro inches) and self-limit around 5 mils depending on the material being plated and the process. Similarly with white tin, laminates with cleaned copper are immersed in a series of tin baths without an external source of electric curren
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef
No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may
Electronics Forum | Mon Jan 04 21:32:40 EST 2010 | boardhouse
Conductive Anodonic Filament My worry is that any extra moisture added to the Lead free Material during assembly may cause this Conductive filament to grow within the material weave. They are water washing after through hole assembly and then after
Electronics Forum | Thu Nov 14 08:53:44 EST 2002 | MA/NY DDave
Hi As DaveF suggested I would contact a shop that has done repair. You should have the PCB/PWB Print and laminate information with you when you make the call. Ask the repair shops if they have continual experience with the Rogers Material you are us
Electronics Forum | Mon Feb 16 11:30:10 EST 2015 | clydestrum
Could anyone point me in the direction of finding out how much strength an SMT pad has in relation to being pulled away from the substrate/laminate? We are in process of trying to build a 6mil thick board and want to know if a chip can be placed onto
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Wed Mar 18 09:03:57 EST 1998 | Earl Moon
| Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago | that deals with this exact subject. Best way to deal with this is to use a ce
Electronics Forum | Thu Apr 27 21:00:32 EDT 2000 | Dave F
Scott: I�m not familiar with some of the things you�re talking about, but let me: * Agree with Russ & Peter regarding immersion silver. * Give some snips of information on the substrate side of things that might help you to tie this together. � FR-1
Electronics Forum | Fri Mar 11 18:47:54 EST 2005 | davef
JD: It's important to note that FR-4 does not contain PBB or PBDE. The bromine in FR-4 epoxy comes in the form of tetra-bromo-bisphenol A [TBBA], which polymerizes and become part of the cross-linked epoxy. Bromine, in the form of hydrogen bromide, i
