Electronics Forum | Mon Jul 24 13:45:14 EDT 2006 | samir
Most Test Technicians, Managers, and everyone else in the organization always believe that the BGA is the #1, and most likely failure mode in a circuit. You can analyze it with all the tools available...2D, 3D, 10D, underneath, etc...... convince th
Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Thu Jul 15 21:41:28 EDT 1999 | Scott McKee
| We have a new facility for producing M/B, RAM modules...etc | what kind of ICT Machines do you recommend provided that. | We have Philips (Topaz & Emerald) for Pick &Place. | Also identify what kind of testing do you recommend during the process |
Electronics Forum | Thu Apr 22 11:04:58 EDT 1999 | Boca
| | I had someone suggest that they weren't really necessary as long as your process is good. Is this just a way to help you keep an eye on your process? | | | | I was thinking, as we set up our line, our money would be more well spent with control
Electronics Forum | Mon Apr 19 14:38:01 EDT 1999 | Chrys Shea
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Thu Jun 24 20:28:58 EDT 2004 | needhelp
We design PCBAs. Our CM assembles the boards for us. So far we have used waterwash SMT process to build the boards. Accidentally, due to documentation errors, we suddenly have a huge batch of boards built with No-Clean process. Although the boards pa
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Fri Jul 21 16:47:17 EDT 2006 | stepheniii
Does replacing the BGA fix the problem? To be a little more blunt, is the BGA or is it the tech says it's the BGA. Beleive none of what you hear and only half of what you see. What kind of BGA is it? If it is one of those BGA's with a built in heats
Electronics Forum | Wed Jan 17 18:08:51 EST 2007 | John S.
We use a fairly simple system. IPC put out standards 7912A and 9261A to define opportunities. Basicly the "number of components" + "number of solder joints" = "number of opportunities." Some six sigma benchmarking studies indicated "Sigma Level" =
Electronics Forum | Mon Apr 02 09:24:16 EDT 2007 | ed_faranda
I do this ALL the time, and it is pretty much transparent to the process. We have done shake, burn in, and functional tests with our products and we didn't have any issues what so ever. We have had a RoHS complient process for well over 18 months n
