New Equipment | Solder Materials
RMA 202-25 is a medium solids, mildly activated liquid flux with a solvent rosin activation formulated to provide a post-process flux residue that is both insulating and non-hydroscopic and does not require cleaning. As a mildly activated rosin based
New Equipment | Wave Soldering
Stand-alone - matches well with any existing wave solder Minimum flux residue by: Minimal spray pressure Optimum distance from nozzle to PCB Edge-off (Pat. pending) feature Ease of Operation - Touch panel D
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
New Equipment | Cleaning Agents
CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea
Technical Library | 2018-08-29 21:17:53.0
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern.
YINCAE’s Fully Flux Residue Compatible Underfill: UF 158HA (Albany, NY) August 15, 2022 YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill.
New Equipment | Cleaning Agents
KYZEN® E5321 is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead free high temperature flux residues from wave pallets an
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
Technical Library | 2018-11-20 21:33:57.0
There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes.
