Electronics Forum: stencil apertures (Page 111 of 121)

Freshman in SMT industry needing advice

Electronics Forum | Tue Mar 09 14:22:09 EST 2004 | billschreiber

There is an article on our web site by Richard Clouthier, �SMT Stencil Cleaning: A Decision That Could Impact Production.� He talks about how high pressure sprays can damage the delicate land mass areas between fine-pitch apertures. High pressure ai

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 09:59:47 EDT 2008 | rarnold

Paste stored tip down, so separation in the tube is not suspect. Remember that the defect was produced on a screen printer running with a Rheopump. A few more details are that the strip of the board containing the uncoalesced solder is consistent w

Re: Printing Adhesive

Electronics Forum | Fri May 07 18:01:11 EDT 1999 | Bill Schreiber

Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist

Re: Printing Adhesive

Electronics Forum | Fri May 07 18:02:37 EDT 1999 | Bill Schreiber

Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist

Re: paste release from stencil, and volume calculation

Electronics Forum | Sat Nov 13 14:09:45 EST 1999 | se

First, let me say what I always say: a good chem-etched stencil will print fine pitch. Chem-etch brings trap to the side walls because its a physical by-product of the process. Because they are less expensive you can add electropolish and still save

Re: Solder Beading Solder Balling

Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup

| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 11:50:08 EDT 1999 | Earl Moon

| | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are u

Re: Epoxy printing and wave soldering on 0603 and 0402 components

Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin

| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |

25 mil QFP soldering issue

Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek

This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet

Re: Cleaning of 'No-Clean' paste

Electronics Forum | Mon Sep 13 11:02:08 EDT 1999 | Bill Schreiber

Mike failed to list the company that introduced the first ultrasonic stencil cleaner in 1990. The company remains the leader in stencil cleaning worldwide: Smart Sonic Corporation Tel: 1(800)906-4407 Fax: 1(818) 909-6409 e-mail: smt@smatrsonic.com w


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