Industry News | 2018-12-18 20:36:04.0
BTU International is pleased to announce that Fred Dimock, Manager of Process Technology, will present during the upcoming SMTA Capital Chapter Meeting. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” at the meeting, scheduled to take place Thursday, Jan. 10, 2019 from 5-7:30 p.m. at ZESTRON in Manassas, VA.
Industry News | 2019-09-21 04:28:31.0
BTU International, Inc is pleased to announce that Fred Dimock, Manager of Process Technology, will present during SMTA International. Dimock will present “Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data” during the Jump Start - 101 Technical Session, scheduled to take place Tuesday, Sept. 24, 2019 from 10:30 a.m. - 4:15 p.m. in the Show Floor Theater.
Industry News | 2021-01-11 15:35:33.0
BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, will host the SMTA Capital Chapter's first chapter webinar of 2021. The webinar, "Operation of a Vacuum Reflow Oven with Updated Void Reduction Data," will take place Wednesday, January 20, 2021 at 11 a.m. EST.
Industry News | 2019-01-04 16:11:03.0
KIC will exhibit in Booth #1215 at the 2019 IPC APEX EXPO, scheduled to take place January 29-31, 2019 at the San Diego Convention Center in CA. Visit the KIC booth for a reflow profiling clinic for void reduction.
Industry News | 2016-07-18 17:00:38.0
KIC today announced plans to participate in the SMTA Carolinas Chapter Tech Session, scheduled to take place Thursday, August 18th in Greenville, SC. The event will be hosted by Hubbell Lighting, Inc. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
Industry News | 2019-07-22 18:08:34.0
KIC announced that MB Allen, Manager for KIC’s Applications & Sales, will present at the SMTA Capital Expo & Tech Forum, scheduled to take place Thursday, Aug. 22, 2019 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD. Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
Industry News | 2016-10-13 15:46:28.0
KIC today announced plans to exhibit at the New England Expo & Tech Forum, scheduled to take place Thursday, November 3, 2016 at the DCU Center in Worcester, MA. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”
Industry News | 2016-10-17 18:55:57.0
KIC today announced plans to exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, Nov. 17, 2016 at the Melbourne Auditorium in FL. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding” at 11 a.m.
Industry News | 2012-05-30 13:23:47.0
Nihon Superior to Offer Voiding Reduction and Aluminum Soldering at Jisso Protec 2012
Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
