Electronics Forum | Wed Mar 15 11:43:45 EDT 2017 | rob
Hi PZ, What, sort of like this one? http://creativeelectron.com/papers/EconomicsofLEDVoiding.pdf It even has the handy calculation for the reduction in thermal performance with voiding.
Electronics Forum | Fri Mar 17 21:38:55 EDT 2017 | jlawson
I think the main driver is MTBF data driven by the Car OEMS, mainly german makers pushing this onto suppliers in supply chain. Vacuum soldering and void reduction is a hot topic for the leading electronics suppliers in Germany at the moment. Is not r
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
Electronics Forum | Wed Aug 26 12:06:44 EDT 2009 | clampron
Good Morning, I have been struggling with this part for some time now. I have to agree that whoever designed this part, did not have to manufacture with it. We have advanced to a point where they have a acceptable yield but I believe that will be hi
Electronics Forum | Mon Apr 27 19:31:12 EDT 2009 | stevek
Remember that the 25% is a reduction in cross sectional area. A void in the middle of the ball that reduces the cross sectional area by 25% is about half the diameter of the ball. If it is closer to either termination, the corresponding size would
Electronics Forum | Wed May 22 19:10:47 EDT 2013 | anvil1021
We do a lot of these devices and I guess I am not familiar the term "Dry Solder". The QFN device is not designed to have a drain hole, but needs to have thermal vias to control heat in most cases. We have used every possible gnd pad design and modifi
Electronics Forum | Wed Sep 01 06:18:05 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, As moisture is eliminated as the cause then solder paste volume will probably be the main contributing factor. More paste means more chance of solder balls and more flux fumes that need to be evaporated to reduce voiding. Even
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Tue Apr 29 11:19:09 EDT 2003 | davef
Metallization failure. A defect such as voids, cracks, separations, depressions, notches or tunnels or any combination in the cross sectional reduction that is a basis for rejection.
Electronics Forum | Sat May 30 01:31:49 EDT 2009 | mika
make 4 square rounded corner apertures on the ground pad and the total reduction of 20 % (80 % solder paste). Then you still be able to solder the terminals around. Don't worry to much of the void's. Just following my tips and you will be fine. The
