Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung
Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass
Electronics Forum | Tue Jan 05 18:19:40 EST 1999 | Dave F
| I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | Chrys | Hey Chrys: I
Electronics Forum | Mon Oct 06 11:39:17 EDT 2008 | reworker
Hi - do you know FINETECH http://www.finetech.de? This machines are the best choice for high end rework applications. here is an overview of possible rework applications; http://www.finetech.de/enid/Applications/Rework___Repair_bs.html . Let me know
Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020
Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co
Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson
Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part
Electronics Forum | Wed Jan 06 10:35:55 EST 1999 | Chrys
| | I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | | | Chrys | | | Hey
Electronics Forum | Wed Jan 06 13:24:25 EST 1999 | Dave F
| | | I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | | | | | Chrys | | |
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Sat Nov 14 08:00:34 EST 1998 | Earl Moon
| Also the preheating of the board is done to help evaporate any water/alcohol that is in the flux - water is a big problem in No-clean processes. From our experience, a temp range around 200f - no more than 220f is ideal for the bigger boards, but t
