ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/hu-HU/divisions/efd/resource-center/thermal-compound-selection-guide
μm vastagságú vastag – több mint 250 μm vastagságú Két alapvető fontosságú hőteljesítmény-jellemző van: a hővezető képesség (thermal conductivity – TC) és hővezetési ellenállás (thermal resistance – TR). Vékony kötőréteg esetén alapvetően a
ORION Industries | http://orionindustries.com/pdfs/SILPADA2000.pdf
) is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pl-PL/divisions/efd/resource-center/thermal-compound-selection-guide
Średnia, od 75 do 250 μm Wysoka, większa niż 250 μm Wydajność cieplna ma dwie krytyczne cechy: przewodność cieplną (TC, Thermal Conductivity
ORION Industries | http://orionindustries.com/pdfs/PDS_GPVOS_0305E.pdf
: 86-21-6464-2209 Features and Benefits • Thermal conductivity: 0.8 W/m-K • Conformable, low hardness • Enhanced puncture, shear and tear resistance
ORION Industries | http://orionindustries.com/pdfs/PDS_GPVOUS_0305E.pdf
• Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Designed for low-stress applications • Puncture, shear and tear resistant Gap Pad VO Ultra Soft is recommended for applications that require a minimum amount of pressure on
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-aluminum-printed-circuit-boards-used-for/
– An aluminum PCB has a base layer made from an aluminum alloy substrate, which has high thermal conductivity and is ideal for electronics that create high levels of heat
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/
. These boards have high thermal conductivity and high operating temperature. They are compact, meaning that they can take up less space than some of their counterparts, and are the easiest types of boards to repair
| http://etasmt.com/cc?ID=te_news_bulletin,23363&url=_print
. Vacuum Soldering Reduction of voids in the solder joint results in: Increased thermal conductivity Low component temperature Increased durability of components
ORION Industries | http://orionindustries.com/q-pad.php
. They are designed to move maximum heat through interfaces which do not require electrical insulation. Both boast a very high thermal conductivity of
ORION Industries | http://orionindustries.com/pdfs/qpad2.pdf
) ASTM D374 Service Temperature °C 180 wo/ac -- 150 w/ac Thermal Properties Q-PAD II Q-PAD 3 Test Method Thermal Resistance, °C-in2/W 0.10 w/o ac 0.10 w/o ac 0.20 w/ac 0.14 w/ac Metric (cm2-K/w) .65 w/o ac .65 w/o ac 1.3 w/ac 0.9 w/ac Thermal Conductivity, W/m-K
