Electronics Forum | Tue Oct 11 06:55:59 EDT 2011 | babithak
Can we use Trichloroethylene (TCE) for cleaning flux on PCB assembly ?
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son
Electronics Forum | Thu Jun 25 11:47:39 EDT 1998 | Steve A
| Hi there, | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | Appreciated for your help. | rgs, | chiakl Chiakl, It looks like you are speaking of what could
Electronics Forum | Wed Aug 23 15:10:24 EDT 2000 | Dr. Ning-Cheng Lee
Fillet lifting is a phenomenon mostly observed at wave soldering. It is caused by mismatch in thermal expansion coefficient (TCE) between solder and parts, and aggravated by the pasty range of solder alloys. Upon cooling, the mismatch in TCE will cau
Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill
What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.
Electronics Forum | Wed Oct 12 00:42:10 EDT 2011 | babithak
My requirement is to clean flux from PCB after soldering. I found information that TCE is harmful to enviroment and human health. But my doubt is is it harmful to electronic components in any way. Does it cause failure of electronic components ? Th
Electronics Forum | Wed Oct 12 07:18:51 EDT 2011 | babithak
My requirement is to clean flux from PCB after wave soldering. I found information that TCE is harmful to enviroment and human health. But my doubt is that is it harmful to electronic components in any way. Does it cause failure of electronic compon
Electronics Forum | Fri Apr 17 14:08:44 EDT 1998 | Earl Moon
| Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else | have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare
Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan
Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.
Electronics Forum | Mon Sep 29 02:35:28 EDT 2003 | Sam
Hi Mantis. Has there been any changes in the BGA itself? One of our BGAs changed to a newer type, and after that we had problems with corner lifting. In that case problem was BGA's structure, there was mismatch in TCE between BGA's substrate and mo
