Electronics Forum | Wed Dec 30 03:23:46 EST 1998 | Bob Willis
| | | | | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | | | | | | | Is there any one who has been running this process in production ? | |
Electronics Forum | Wed Dec 30 09:09:42 EST 1998 | Earl Moon
| | | | | | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | | | | | | | | | Is there any one who has been running this process in production
Electronics Forum | Mon Jun 25 20:47:09 EDT 2001 | davef
Much of the focus of pick & place machine supplier development efforts seems to directed towards either: * Head location detection, adjustment, and control. OR * Component location prior to pick-up. OR * Component position error correction after pick
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
