Electronics Forum | Sun Sep 08 15:07:42 EDT 2013 | davef
PCB designers specify the application of solder mask [eg, varnish, solder stop mask, solder resist, etc] to fabricators to reduce the potential of bridging between two conductive traces during assembly soldering processes [eg, wave, reflow and hand s
Electronics Forum | Sun Sep 08 15:41:30 EDT 2013 | rodcr
I read an article about signal integrity losses and ENIG applied to all of the traces on the board. Doesn't solder mask protect the traces? Why would you need ENIG on the entire board?
Electronics Forum | Mon Jun 15 20:37:29 EDT 2020 | travishemen
Try sending your boards to rework before SMT and have them remove the excess solder from the fiducials. It usually works great until someone accidentally removes the entire fiducial.
Electronics Forum | Tue Jun 16 14:35:13 EDT 2020 | dwl
for the fiducials, try a donut shape instead of a disc. The HASL solder seems to settle more evenly on a donut than it does on a dic.
Electronics Forum | Mon Jun 15 16:51:05 EDT 2020 | emeto
Tin/Lead has 183C melting point and probably around 220 peak temperature at reflow. Tin has 232C melting point. I would assume that based on this information you would understand why intermetallic joint is questionable. Go to any flat finish. HASL wi
Electronics Forum | Sun Sep 08 18:06:30 EDT 2013 | davef
Protect the board: If solder mask protects the board, the level of protection is limited and inconsistent. If you want protection, you need the be thinking conformal coating. Selective ENIG: I believe the reason solderability protection, except mayb
Electronics Forum | Sun Jun 14 03:02:14 EDT 2020 | kylehunter
We did a batch of boards with lead free HASL that we thought was leaded. Using standard leaded paste worked, but we did have some wetting issues. The issues were resolved when switching back to leaded HASL. Can't speak to your specific fiducial issu
Electronics Forum | Tue Jul 13 16:35:25 EDT 2004 | Richard
Sounds like your Si plalladium finish has oxide on it from the firing or sitting around too long. I used to assemble LTCC and have had plenty of dealings with this matter. The best and easiest is to get an active type flux and solder paste. AIM makes
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Wed Jun 24 16:51:25 EDT 2020 | kumarb
Hi. Taking this from a total different angle - why not use ENIG to avoid this issue but find more competitive suppliers? We source from offshore all the time and finding that due to this dreaded virus - the market pricing is soft. Many are willing to
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