New Equipment | Industrial Automation
Contact: Sandy Lin mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s -
New Equipment | Industrial Automation
Contact: Sandy Lin mailto:unity@mvme.cn Skype: live:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s -
Industry News | 2012-10-30 21:59:40.0
The latest devolopments in the OLED lighting space will be one of the major topics at the forthcoming Printed Electronics USA 2012 conference & exhibition (www.printedelectronicsusa.com). The event, being held on December 5-6 in the heart of silicon valley at Santa Clara, CA, USA, focuses on the commercialization of the technology, covering broadly organic, inorganic, thin film and flexible nanotechnologies.
Industry News | 2014-03-24 13:39:01.0
A consortium of partners will launch the world's first flexible timer based on printed electronics at the IDTechEx Printed Electronics Europe event in Berlin, April 1-2. The device consists of an electronic logic circuit implemented with thin film metal oxide transistors, powered by a printed battery, and integrated onto a paper substrate. It has four timing sequences and is designed for multi-functional use across four different applications.
Industry News | 2017-03-08 19:49:16.0
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.
