New Equipment | Wave Soldering
> ◇Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. ◇External streamline design and modularized desi
New Equipment | Wave Soldering
> ◇Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. ◇External streamline design and modularized desi
New Equipment | Wave Soldering
> ◇Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. ◇External streamline design and modularized desi
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
Welcome to this Defect of the Month video on monitoring flux application for wave and selective, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the l
New Equipment | Education/Training
Second edition of the CD provides a guide to all aspects of wave soldering with all the common process defects. Each stage of the process including fluxing, pre heat, solder wave and conveyors are explained along with materials used and the changes n
New Equipment | Wave Soldering
Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis. External streamline design and modularized design inside
Technical Library | 2020-07-29 20:12:52.0
Aluminum is a metal that it is hard to solder due to the high surface tension difference between it and molten solder alloy. This occurs because aluminum rapidly forms a tenacious oxide layer whenever it is exposed to oxygen in the air. The oxide layer is responsible for the high surface tension difference between the aluminum and the solder and impedes the solder from spreading evenly on an aluminum surface. There are hundreds of aluminum alloys available in the marketplace; it is important to identify the form of aluminum that is being soldered. Once this is done, an appropriate soldering technique can be chosen for soldering the specific aluminum alloy under consideration. Direct aluminum soldering eliminates using expensive plating techniques to prepare the aluminum surface for soldering.
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