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Express Newsletter: pop (Page 2 of 4)
SMTnet Express July 25 - 2013, Subscribers: 34972
A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines
A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE
Design and Construction Affects on PWB Reliability
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
The Surface Finish Effect on the Creep Corrosion in PCB
SMT Manufacturability and Reliability in PCB Cavities
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Minimizing Voiding In QFN Packages Using Solder Preforms
SMTnet Express May 23 - 2013, Subscribers: 26128
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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