Full Site - : pb free bga sn/pb paste (Page 2 of 44)

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Industry News | 2015-02-04 18:05:58.0

he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Surface Mount Technology Association (SMTA)

Call for Papers: International Conference on Soldering and Reliability

Industry News | 2010-01-22 21:37:52.0

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.

Surface Mount Technology Association (SMTA)

SMTA Announces February Webinars and Webtorials

Industry News | 2010-01-22 21:46:55.0

Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Best Papers from SMTA International Announced

Industry News | 2023-03-16 14:31:59.0

The SMTA is pleased to announce the Best Papers from SMTA International 2022. The winners were selected by members of the conference technical committee. For these exceptional achievements, a plaque is given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

SMTA China Announces 2012 Paper/Presentation Awards

Industry News | 2012-05-09 13:57:33.0

SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony,

Surface Mount Technology Association (SMTA)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

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