Electronics Forum | Thu Apr 22 07:51:32 EDT 1999 | Vic Lau
after soldering transistors on a flex circuit (Ni/Au plated), one of the lead lift-up from the pad. under microscope (1,000 X), i find some cracks on the the pad surface. with edx analysis, the surface is mainly nickel. have you ever encounter suc
Electronics Forum | Mon Apr 05 04:50:28 EDT 2004 | harris
Hello: What's the difference of the OSP, HASL, Ni/Au immersion and ENIG? What's the advantage and disadvantage of them, special for the BGA pad? I had seen some discussion in the forum, but they are for a long time ago. Could somesone can give me the
Electronics Forum | Mon Dec 20 08:23:30 EST 2010 | johanhuizing
The buyers in our company like to change the PCB finishing because of reducing costs. The proposed change is going from Ni/Au to HASL lead free, I know that in the beginning of the lead free period there where a lot of problems to use the HASL especi
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Wed Mar 07 16:14:24 EST 2007 | Mark
Hello, We replated the boards with new Ni and Au and the soldering flow is excellent. There is 100% covarage of the pad even for reduced appertures. Mark
Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan
Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati
Electronics Forum | Thu Jun 19 08:15:28 EDT 2003 | rmurtuza
Which is the best surface finish to be used on non- solder mask defined pads in terms of cost and reliability? What are the advantages and disadvantages of the various surface finishes such as Ni/Au , Cu OSP , Ni /Pd and HASL.
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
Electronics Forum | Mon May 01 15:04:15 EDT 2000 | Ernie Miller
I need a good cleaning cycle for leaded brass (CuZn39Pb3). Product to be ni/au loose peice plated
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
