Industry News | 2010-03-22 13:59:02.0
GREELEY, CO — FCT Assembly introduces its NL932 no-clean, lead-free, halide-free solder paste. The paste features excellent solderability, enabling the process to handle the most difficult wetting requirements.
Industry News | 2011-04-20 20:31:30.0
FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.
Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Industry News | 2016-05-16 20:13:12.0
NEO Tech announces that it will showcase its high-reliability substrate and microelectronic assembly capabilities in booth 2143 at the 2016 IEEE International Microwave Symposium IMS 2016, which is schedule to take place from May 24-26 at the Moscone Center in San Francisco.
EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
Minimum line width/distance: 4mil; Minimum aperture: 0.25mm; Technique: Immerged Ni/Au+Entek; Layers and thickness: 7/L, blind hole board
客户的计算机电路板是根据客户提供的计算机电路板,是根据客户提供的计算机电路板,来解决生产的问题。电路板。 基础类型:工业生产 材料加工工艺:0.635mm 导电层:Cu,Ni,Au 金属层厚度:300μm 表面处理:浸金 金属单面/双面:单面 镀铜通孔:没有 焊锡面膜:没有
在现代工业生产中,特别是自动化生产过程中,应使用不同类型的传感器来监控生产中的关键参数,使机器保持正常或最佳状态,使产品保持最佳质量。 传感器陶瓷电路板广泛用于汽车电子、汽车工业自动化、电设备、计算机、电信、航空航天、数字传说、数字电视和其他消费电子产品。 基础类型:工业生产 材料加工厚度:1.0mm 导电层:Cu,Ni,Au 金属层厚度:300μm 表面处理:浸金 金属单面/双面:双面 镀铜通孔:是的 焊锡面膜:没有
Industry News | 2010-04-11 02:21:50.0
GREELEY, CO — FCT Assembly announces that it has been awarded an NPI Award in the category of Flux for its NC160 lead-free flux. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2010-09-29 23:32:58.0
Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.