Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Tue Aug 18 10:05:11 EDT 1998 | Ben Salisbury
Question: If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? I'm currently running into this proble
Electronics Forum | Wed Aug 22 17:00:51 EDT 2001 | Doug Chambers
I am researching articles with respect to intermetalics growth associated with gold as a final metalization. We are currently looking at a few options that include a 10uin flash followed by a 30uin selective and a total 30uin finish. The concern is
Electronics Forum | Fri Feb 11 09:44:01 EST 2005 | pjc
A touched-up solder joint is never as reliable as one soldered correctly by machine. Touching up adds more heat thereby increasing the thickness of the intermetalic bond. Our goal is to have the thinest intermetalic bond in our solder joints. The int
Electronics Forum | Fri Feb 15 17:50:30 EST 2008 | stevek
Creating a sound tin nickel intermetalic takes a bit more energy than other finishes (such as copper or tin). You can achieve wetting, but not have a viable intermetalic. You should cross section some intact boards from that process and see what th
Electronics Forum | Wed Nov 17 10:03:29 EST 2010 | scottp
Instead of a minimum thickness, we require no exposed copper or SnCu intermetallic. We've been having a lot of trouble lately with suppliers of SN100 HASL boards giving us pads with very irregular solder deposits with areas of exposed intermetallic.
Electronics Forum | Tue Aug 18 16:10:40 EDT 1998 | Earl Moon
| Question: | If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? | I'm currently running into this
Electronics Forum | Tue Sep 26 20:04:31 EDT 2000 | Dave F
Wolfgang: I think that we were answering different questions. * I thought Bill wanted to talk about minimizing the amount of gold in the solder connection that is available to make intermetallics * You were talking about the formation of intermeta
Electronics Forum | Mon Jul 06 20:32:34 EDT 1998 | Chiakl
Hi there, I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? Thank in advandce. rgs, chiakl
Electronics Forum | Wed Aug 22 17:04:56 EDT 2001 | Doug Chambers
Sorry for the abridged post� The remainder of the post was to ask if anyone is aware of any papers or proceedings that discuss problems associated with thick gold finishes and intermetalics. Thanks, Doug
