Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Fri Oct 19 11:51:25 EDT 2007 | rgduval
By definition, no clean solder can be not-cleaned. The solder/flux are formulated to result in low ionic-contamination, hence, no cleaning. I have, however, always had at least one customer that requests their no-clean solder get cleaned. No-clean
Electronics Forum | Fri Oct 19 13:57:17 EDT 2007 | Michael Konrad
Hi Rob, I must take issue with your statement �By definition, no clean solder can be not-cleaned�. All no-clean fluxes can be cleaned. Whether or not one cleans no-clean depends on a variety of factors. More than eighty percent of all post reflow
Electronics Forum | Tue Jan 30 18:25:25 EST 2018 | aqueous
This is one of the most common questions I get asked. Why clean no-clean flux. It was stated earlier that no-clean residues are benign. This may or may not be accurate. It depends on several factors including the reflow process. In a perfect world, t
Electronics Forum | Mon Mar 17 18:37:59 EDT 2008 | aqueous
We manufacture both bulk and localized ionic contamination testers. My answer is from the perspective of the cleanliness testing method. The issue with all bulk ionic contamination testers (Ionagraph, Omegameter, Zero-Ion), is that they test the en
Electronics Forum | Sat Mar 27 12:36:34 EST 1999 | Scott Cook
| Hi, | I have a customer who's electronic assemblies produce RF. He is insisting upon aqueuos cleaning. We switched to a no clean solder years ago and no longer have an aqueous system. | Is aqueous cleaning necessary to eliminate 'cross talk' of
Electronics Forum | Thu Sep 17 11:09:32 EDT 1998 | Dave F
| I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas? Wayne: More of the same as Chry and Justin. KEY ISSUE The first thing that you need to know is: What does your customer me
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Mon Jun 28 10:03:22 EDT 2004 | davef
First, welcome to your new job. Second, IPC-TM-650 2.6.14 is only loosely an �Ionic Contamination (Electromigration) Test�. * Electromigration Test, IPC TM 650 2.6.14, 2.6.14.1 * Ion Chromatography for Ionic Cleanliness, IPC TM 650 2.3.28 Third, I
