Electronics Forum | Wed Oct 28 17:17:12 EST 1998 | Lennox Bennett
I would like to know if there are any standard guidelines for the development of Process Failure Mode and Effect Analysis. If there is can you refer me to the source. I would also like to be referred to any source relating to current developments in
Electronics Forum | Fri Apr 19 11:10:34 EDT 2002 | Steve Bondarewski
I am part of a software company looking for electronic industry feedback for the perfect FMEA software tool. Understanding how boring FMEA studies can be, how can FMEA software be improved to reduce liability and increase innovation? Basically, I wa
Electronics Forum | Mon Oct 16 11:25:11 EDT 2006 | charless
Yes of course. The leg of the component breaks between the top of the solder joint and the component body. We can induce the same failure mode with lead free joints but usually after 10x longer on vibration.
Electronics Forum | Mon Aug 06 05:12:20 EDT 2007 | wayne_
Hi Is there any standard or requirement to test the solder under high power operation? For example, a power switching device, what is the failure mode of the solder joint after the whole equipment undergone a high power (current / voltage) environmen
Electronics Forum | Thu Sep 06 10:12:27 EDT 2007 | slthomas
"...but it would also be testing if they had enough mechanical strength to hold the components on." Only if you take the time to observe the results. :) Your point is well taken, but these guys were only interested in seeing if any failure modes pro
Electronics Forum | Thu Feb 11 09:09:33 EST 2010 | ssager
We currently still build a fair amount of boards with through hole parts. These parts are placed by hand using kits, so there is always the "human" factor that tends to play into the root cause of the failure mode. Has anyone seen, heard of a method
Electronics Forum | Mon Aug 08 16:23:45 EDT 2011 | slthomas
I'm pretty sure that what Davef is suggesting is that rapair is one thing people here could definitely provide expertise for, but troubleshooting and identifying the failure mode (what needs to be repaired) is another thing entirely.
Electronics Forum | Mon Sep 11 14:15:28 EDT 2000 | Gary
I am looking for some details about the failure modes in popcorned components. Does the component usually fail to operate. Is the damage likely to extend to the gold bond, wires, or substrate. We have experienced a high failure rate on a subset of
Electronics Forum | Thu Oct 12 09:22:12 EDT 2006 | charless
Hi We are experiencing different failure modes between leaded and lead free through hole assemblies. The boards are PTH. In the case of lead free boards we are seeing fracturing of the component legs much earlier than we do with leaded assemblies. N
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
