Industry News | 2013-09-10 12:18:26.0
The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.
Industry News | 2011-09-23 22:09:26.0
Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
Industry News | 2002-07-25 15:33:58.0
Glenbrook Technologies has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system, "Oversized" Jewel box 90-C. The system facilitates x-ray inspection of larger assembled printed circuit boards (PCBs) up to 18" x 24".
Industry News | 2016-03-02 12:50:36.0
The Jewel Box Ultra Compact is a full featured microfocus x-ray system that can easily fit on a desk or in a small lab. It offers up to 500x geometric and 2,000x electronic magnification. The Jewel Box Oversize is designed for backplane and LED panels. The system can accommodate a 24" x 24" panel and the positioner can fully scan 23" x 12".
Industry News | 2010-03-24 14:00:36.0
ITASCA, IL - Kester announces that representative Gardner & Meredith will showcase its NXG1-HF, a lead-free no-clean solder paste, at the upcoming SMTA Atlanta Expo and Tech Forum, scheduled to take place Thursday, April 15, 2010 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2023-11-20 13:47:24.0
MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.
Industry News | 2014-09-23 11:18:59.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys.
Industry News | 2001-11-13 13:41:24.0
Glenbrook Technologies Inc., an innovator and leading supplier of Real-time X-ray Inspection Systems to the electronic fabrication and semiconductor assembly industries has announced the availability of a newly developed large capacity, ultra-high resolution X-ray inspection system called the "Oversized Jewel Box 70-T". Glenbrook's award-winning X-ray camera technology combines a 10 Micron, 70kV X-ray source with extremely small "Source to Image Distance" (SID) to capture ultra-high resolution images.
