Electronics Forum | Fri Aug 15 00:51:30 EDT 2008 | boardhouse
Hi Paul, My discloser, I sell for an offshore house, this is Crap.... Section 3.4.3 Annular Ring (External) of IPC-6012A, which also calls out Table 3-5, states that "Plated-through holes identified as vias can have up to 90 degrees breakout of t
Electronics Forum | Tue Sep 04 09:38:38 EDT 2012 | cobham1
The best thing you can do is to clean the board that has a solder paste defect on it. If you don't you probably will have issues after reflow. This could include bridging, raised parts, or any number of issues. You need to remember that if you are re
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Thu Jun 02 08:42:06 EDT 2016 | emeto
Several important things to watch. 1. More paste can result in more voiding(I usually shoot for 50-65% coverage) 2. Make a different grid(windowpane) for you pad - try with more smaller windows 3. Try both ramp to spike or Soak profiles and see whic
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Jun 03 13:56:09 EDT 2009 | mika
less total area of voids, which mean a much more strength in the joint and much easier to solder such a cooling pad grounded via vias, with this approach! The same goes for big cooling pads of let say Power transistors without any via etc. Always re
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Fri May 15 18:18:51 EDT 1998 | Earl Moon
| Help! | We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The
Electronics Forum | Thu Jun 25 14:45:55 EDT 1998 | Chrys
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
