Industry News | 2020-09-17 11:48:34.0
MAGNALYTIX® today announced its participation in the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 where you will have access to chat live with a MAGNALYTIX team member and the On-Demand Conference & Expo will take place Sept. 28-Oct 23, 2020. The MAGNALYTIX team will present three papers during the On-Demand Conference.
Industry News | 2016-03-03 10:33:15.0
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
Industry News | 2010-09-22 14:19:03.0
Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will showcase its AQUANOX® A4625 Aqueous Cleaner for Lead-Free Flux Residues at the upcoming SMTA Long Island Tabletop Vendor Show, scheduled to take place Wednesday, October 13, 2010 at the Islandia Marriott Long Island in Islandia, NY.
Industry News | 2010-04-28 14:32:23.0
NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Phil Zhang has been awarded Best Presentation of Vendor Conference One (CE10) at the SMTA China East 2010 Award Presentation Ceremony for the presentation titled "Flux Residue and Its Impact on Reliability."
Industry News | 2017-04-11 21:21:11.0
KYZEN today announced plans to participate in the Contamination, Cleaning & Coating Conference, scheduled to take place May 22-24, 2017 in Amsterdam. The event is co-organized by SMTA and SMART Group. Mike Bixenman, DBA, KYZEN Corporation will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” in Session I entitled “Residues Trapped under Component Terminations”. All presentations in this session will address a common question faced by OEMs when designing electronic hardware: How clean is clean enough?
Industry News | 2012-11-08 12:01:36.0
Kyzen, will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.
Industry News | 2015-01-13 11:54:43.0
Indium Corporation's Eric Bastow, assistant technical manager, will present at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Bastow's presentation, Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?, explores the electrical reliability of two no-clean solder pastes stored under various conditions and aged over different time intervals.
Industry News | 2010-03-30 14:09:38.0
OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman will present a paper titled "Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
