Electronics Forum | Mon Jul 01 16:15:02 EDT 2002 | Matt Kehoe
We are currently trying to gather information pertaining to applying LPI soldermask thicker than normal. The thick coating is necessary for the SIPAD ssd process however, because of the numerous brands of mask and application methods there is no sing
Electronics Forum | Wed Jul 06 15:52:36 EDT 2011 | duso02
Ricky What silicone coating are you using? Are you using at as a coating or as a potting? In other words how thick are you applying it.
Electronics Forum | Wed Mar 02 07:47:57 EST 2016 | deanm
Sounds like over molding would be ideal, but if they don't want to spend for a mold I would look at silicone conformal coatings that can be used in a dip process. Silicones are thicker than other coating materials and multiple drippings may provide t
Electronics Forum | Wed May 17 16:36:27 EDT 2023 | tey422
From my previous experience with silicone, it tend to be need to spray with thick coating(s) and it's more watery. The boots doesn't work too well in those cases. Just a note, now I am no longer working with silicone. For conformal coating, best m
Electronics Forum | Thu Nov 03 14:23:58 EST 2005 | Samir Nagheenanajar
Thank you for the advice. I am not so concerned with the "2nd reflow", as the same can be said for double sided reflowed PCBA's (the bottom-side parts essentially go through a 2nd reflow). As for the HASL, there is a formula in calculating how much
Electronics Forum | Wed Apr 28 09:37:54 EDT 1999 | Justin Medernach
| We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | We are considering trying boards with White Tin solderable surface
Electronics Forum | Mon Jun 14 21:02:50 EDT 2004 | hap
it is not practical to target an exactly 1 mil film thickness, the materials manufacturers do not give an exact solid content figure but only a target range. temperature and batch preparation also play a small role. You could probably target 1 mil p
Electronics Forum | Tue Mar 20 20:14:40 EST 2001 | davef
Electroplating [electrolytic] and dipping [HASL] are the two methods for applying solder coatings to features on boards. Disadvantages of electroplating lead / tin are: * "Weak knees" created at the edge of plated through holes. [I used to get weak k
Electronics Forum | Fri Nov 09 16:59:32 EST 2001 | davef
Dunno. What is your goal in coating boards? What material are you using? How thick are you applying this material?
Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw
Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.
