New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
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New Equipment | Test Equipment
feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat
New Equipment | Test Equipment
feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat
New Equipment | Test Equipment - Bond Testers
feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat
New Equipment | Test Equipment - Bond Testers
• 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function workstation with±70° tilt and X-Y-Z-Q-M multi-axis movement and CNC auto-detect &bu
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r
Application Field SMT/PCBA Package type：BGA、LGA、CSP、POP、SIP... Defect type：Void、HIP、Insufficient、Bridge... Semiconductor Package type：W/B、IC、F/C... Defect type：Void、Open、Short、Sweep、Solder ball... Other areas
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