Electronics Forum | Fri Jan 16 07:00:32 EST 2004 | mk
ssd eliminates voids from BGA's. Check out http://www.sipad.com
Electronics Forum | Fri Aug 16 09:59:49 EDT 2002 | dason_c
We baked the board first and print 2 mil water soluble paste at the BGA location and reflow. Wash and baked before the production run.
Electronics Forum | Thu Aug 15 15:58:12 EDT 2002 | robertnguyen
To whom this may concern, I recently ran into the problem with vias on pads of BGA when place BGA and reflow gas trap on vias escape and result in ball having void greater than 50% of BGA diameter. The BGA pad is measured at 20 mils and the vias mea
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Electronics Forum | Thu Jul 26 17:43:57 EDT 2007 | tphan
Board had a via hole underneath of the solder pad of the BGA. When it run through reflow oven, it caused a lot of void. How to correct this issue?
Electronics Forum | Thu Nov 07 15:55:30 EST 2002 | Debi Musante
The XRAY looked okay with minimum voids throughout. Customer reports insufficient contact causing intermitten failures.
Electronics Forum | Fri Nov 12 09:08:54 EST 1999 | mart weakley
Has anyone put together all the key parameters/drivers for voids on high density BGA's?? Thanks, Mart Weakley
Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef
You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the
Electronics Forum | Thu Jan 15 09:40:47 EST 2004 | davef
Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429 Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed ro
Electronics Forum | Thu Nov 02 22:05:55 EST 2000 | Dason C
Chris, can we share some more information? I am running Motorola 357 BGA with PN XPC860MHZP50C and the problem for me is a large amount of void (checked by 5DX). I checked the ball surface and found some sketch on every single ball (it may caused by
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