Industry Directory | Consultant / Service Provider / Manufacturer
EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
Industry Directory | Manufacturer / Other
Tecate Transformers have proudly engineered, manufactured, and distributed all the finest transformers, Inductors, Toroids, Harness, Air Coils, and Electrical Boards. We provide electronic assembly and manufacturing services.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
SMT Vacuum Lead-Free Hot Air Reflow oven for pcb smt assembly line Features: HR Series High End/Nitrogen Reflow Soldering Machine ¤Suitable For High End Products/Critical Process Criteria ¤6, 8, 10, 12 Heating Zones Available ¤Single/Dual Lane
Electronics Forum | Sat Jul 01 00:20:08 EDT 2017 | aemery
Kelly, it's been a long while since I repaired a BRAVO. The machine was a little unique as far as Electrovert ovens go. I am pretty sure that it is the only Speedline model that integrated a PLC. Loved the OMNI's, not so much with the Bravos. I a
Electronics Forum | Fri Aug 20 11:34:11 EDT 2004 | soease
Hi Grant, sly again. I was searching for some infos about Auto-SIR, and I found something that may interrest you; Concoat, wich is the company who sells Auto-SIR systems, also has profiling tools and they seem to have a more powerful software to ana
Used SMT Equipment | Soldering - Reflow
REHM Condenso-Batch Vacuum Vapor Phase Reflow Oven Year 2008 Tension: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Aspiration 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm
Used SMT Equipment | Soldering - Reflow
Lead Free Vitronics XPM2 Convection Reflow Oven, # X2A100085,Edge Rail and Mesh Belt Auction Item: www.xlineassets.com Jabil # 45 Auction Other Available Equipment In Same Auction 2012 MVP Spectra AOI Vitronics XPM2 Convection Reflow Oven
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2021-11-05 07:31:03.0
MIRTEC is pleased to announce that it received a 2021 Mexico Technology Award for its revolutionary MV-9 SiP HYBRID 3D AOI system. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
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Parts & Supplies | Assembly Accessories
Original new Speedline Blower motor for reflow oven Part NO. R2E120-A016-09 More SMT parts available H1067R A12GD25-1L-Z FUJI CP6 Solenoid valve H1068Z PCD2413-NB-D24 FUJI CP643 13 Solenoid valve H1082T RCS-242-M3-D24MP Solenoid valve H1084A
Parts & Supplies | Soldering - Reflow
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Good Price Reflow Oven Soldering Machine ❙ Introduce of Reflow Soldering Oven High quality SMT reflow ovens, PCB soldering oven machine, lead-free reflow oven, for PCB soldering. ETA SMT machines manufacturers offers from 6-12 zones good pr
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | San Pablo City, Laguna, Philippines | Engineering,Maintenance,Production,Sales/Marketing,Technical Support
Some key points you may find relevant to this job opportunity include: Extensive experience and knowledge on Service and Technical skills by performing Set-up, Buy-off, troubleshooting of the assigned Equipments. Provide solution to custom
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMTnet Express, July 11, 2019, Subscribers: 32,142, Companies: 10,832, Users: 24,923 Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow Credits: Heller Industries , Alpha Assembly Solutions , MacDermid Enthone Electronic
| http://etasmt.com/cc?ID=te_news_bulletin,23565&url=_print
Voidless / Vacuum Reflow Soldering Oven-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News
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LV Series Vacuum Reflow Oven from China, LV Series Vacuum Reflow Oven Manufacturer & Supplier - I.C.T SMT Machine English Bahasa indonesia Сербия
